liquid epoxy resin and hardener (407) Online Manufacturer
Liquid Glue: Epoxy APG Resin System For Indoor Applications
Cas No.: 68928-70-1
CAS No.: 1675-54-3
Molecular Formula: C21H24O4
Classification: Double Components Adhesives
Usage: 12kV - 40.5kV Contact Boxes, Insulators, And Other Related Products
Classification: Double Components Adhesives
Usage: Insulation Products, Connectors, Etc.
CAS No.: 1675-54-3
Classification: Double Components Adhesives
CAS No.: 1675-54-3
Molecular Formula: C21H24O4
CAS No.: 1675-54-3
Molecular Formula: C21H24O4
CAS No.: 1675-54-3
Classification: Double Components Adhesives
CAS No.: 1675-54-3
Molecular Formula: C21H24O4
CAS No.: 1675-54-3
Molecular Formula: C21H24O4
CAS No.: 1675-54-3
Molecular Formula: C21H24O4
CAS No.: 1675-54-3
Molecular Formula: C21H24O4
CAS No.: 1675-54-3
Molecular Formula: C21H24O4
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