Fast Curing Low Stress Epoxy Encapsulation Resin with High Dielectric Strength for Electrical Epoxy Resin Insulation

The LE-9229/LH-9229 epoxy resin system is a dual-component, modified rubber-toughened formulation designed for demanding electrical insulation applications. Combining LE-9229 epoxy resin and LH-9229 hardener at a precise 1:1 ratio (100 pbw each) with silica flour filler (280-340 pbw), this system delivers exceptional thermal stability (Tg 105-125°C), crack resistance, and mechanical strength. Ideal for medium/high-voltage insulation (10-35kV), it supports both automatic pressure gelation (APG) and vacuum casting processes, making it suitable for transformers, solid-pole bushings, and switchgear components.

• Ultra-High Thermal Resistance:
  Glass transition temperature (Tg): 105-125°C
  Thermal decomposition: >320°C
  Low water absorption: 0.08-0.20% (23°C to 100°C)
• Superior Electrical Insulation:
  Volume resistivity: 10¹⁵ Ω*cm
  Dielectric strength: 30 kV/mm
  Loss factor: 0.02
• Robust Mechanical Properties:
  Tensile strength: 65-95 MPa
  Flexural strength: 110-150 MPa
  Impact resistance: 10-18 kJ/m²
• Process Flexibility:
  Optimized for APG injection (10-30 min gelation) and vacuum casting (3-6 hr cure).
  Low curing shrinkage (0.7-0.9%) ensures dimensional stability.