Name: Epoxy Resin with Mold Release Agent for Electrical Insulation
Brand: Shanghai Wenyou Industry Co., Ltd.
SKU: LD605
Price: 3.40 USD
Availability: InStock

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Epoxy Resin with Mold Release Agent for Electrical Insulation

electrical epoxy resin with mold release

epoxy resin for electrical insulation

insulating epoxy resin with release agent

Place of Origin:

Shanghai, China

Brand Name:

WENYOU

Model Number:

LD605

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Epoxy Resin with Mold Release Agent for Electrical Insulation

Product Details

CAS No.:

1675-54-3

Molecular Formula:

C21H24O4

EINECS No.:

216-823-5

Main Raw Material:

EPOXY

Composition:

Two Component Resin System

Appearance:

Transparent Liquid

Packing Size:

20kg/pail Or 220kg/drum Or 1200kg/tank

Curing Method:

Air Fast Curing

Adhesion Property:

Good Adhesion To Surface

Release Method:

Spraying, Scraping, Dipping

Mold Cleanliness:

Reduces Dirt Accumulation

Defect Reduction:

Reduces Defective Rate

Multiple Demolding:

Multiple Demolding Cycles

Surface Preparation:

Requires Mold Drying

Product Appearance:

Improves Product Appearance

Payment & Shipping Terms

Minimum Order Quantity

Price

$3.40-3.60

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Product Description

China Epoxy Resin with Mold Release Agent and Mold Cleaner

Product Specifications

Attribute	Value
CAS No.	1675-54-3
Other Names	Epoxy resin potting compound
MF	C21H24O4
EINECS No.	216-823-5
Classification	Double Components Adhesives
Main Raw Material	EPOXY
Usage	Construction, Transformer, insulator, bushing
Type	Epoxy Resin Compound
Certification	ISO 18000
Application	Electrical power insulation
Composition	Two component resin system
Product name	epoxy resin and hardener
Appearance	Transparent liquid
Packing	20kg/pail or 220kg/drum or 1200kg/tank
Brand	Wenyou

Product Description

LD605 is mainly used as a release agent for epoxy resin products, especially for difficult-to-release, complex mold insulating parts, transformers, high-voltage switches, dry-type transformers, and other epoxy carbon fiber products.

Key Performance Features

Clean, colorless, oil-free with excellent surface adhesion
Easy to operate and apply
Does not transfer to molded products and improves product appearance
Fast air curing capability
Maintains mold cleanliness for extended periods, reducing defective rates
Supports multiple demolding cycles with single application
Reduces dirt accumulation on mold surfaces

Application Instructions

For optimal release effect, first clean the mold surface with cleaning agent to remove all traces of previous release agents. Application methods include brushing, spraying, scraping, or dipping. Production can begin immediately after solvent evaporation.