Place of Origin:
China
Brand Name:
WENYOU
Certification:
REACH/RoHS/UL/SGS/IOS
Model Number:
LE-9516/LH-9516
Document:
Viscosity | 200-500 |
---|---|
Process | APG & Vacuum Casting |
Thermal Decomposition | >320°C |
Adhesion Strength | Strong |
Primary Usage | Electrical insulation |
Component | Designation | Quantity |
---|---|---|
Epoxy resin | LE-9516 | 100pbw |
Hardener | LH-9516 | 100pbw |
Filler | Silica | 350-400pbw |
Color paste | LC- | 3pbw |
Resin LE-9516 Properties | Curing Agent LH-9516 Properties | ||||
---|---|---|---|---|---|
Property | Unit | Standard | Property | Unit | Standard |
Appearance | Visual | Transparent-yellow liquid | Appearance | Visual | Transparent-yellow liquid |
Epoxy value | Eq/kg | 4.0-4.5 | Viscosity at 25℃ | mPa.s | 150-400 |
Viscosity at 25℃ | mPa.s | 500-1500 | Density at 25℃ | g/cm3 | 1.17-1.24 |
Density at 25℃ | g/cm3 | 1.16-1.20 | VP | Pa | About 0.5 |
VP at 25℃ | Pa | <0.01 | Flash point | ℃ | About 140 |
Flash point | ℃ | About 135 |
Parameter | Automatic Pressure Gelation | Vacuum Casting |
---|---|---|
Mixing temperature | 40℃/1-2h | 50-60℃/1-1.5h |
Feeding method | Pressure (0.5-5bar) | Vacuum (casting pot) |
Mold temperature | 130-150℃ | 105℃/4-6h |
Gelation time | 10-50mins | 80℃/4h+100℃/2h+120℃/2h |
Post-curing | 130-140℃×6-10h | 130-140℃×6-10h |
LE-9516:LH-9516=100:100
Temperature | Gel Time |
---|---|
120℃ | 20-40mins |
140℃ | 9-18mins |
160℃ | 4-8mins |
Test system: Resin LE-9516 / curing agent LH-9516 / silica flour=100/100/400
Curing conditions: 120°C × 4hours +140°C × 8hours
Property | Typical Results | Property | Typical Results |
---|---|---|---|
Tg(DSC) | 60-80℃ | Thermal decomposition temperature | >320℃ |
Tensile strength | 60-80N/mm2 | Water absorption rate (23°C × 10 days) | 0.10-0.20 %by wt. |
Flexural strength | 100-130N/mm2 | Water absorption rate (100°C × 60 minutes) | 0.08-0.15 %by wt. |
Compressive strength | 140-190N/mm2 | Surface resistivity | 1014 Ω |
Impact strength | 8-16kJ/m2 | Volume resistivity | 1015 Ω.cm |
Curing shrinkage | 0.8-1.0% | Dielectric strength | 31 kv/mm |
Flame resistance (4mm) | HB level | Dielectric loss | 0.02 |
Thermal conductivity | 0.8-0.9W/mk |
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