Place of Origin:
China
Brand Name:
WENYOU
Certification:
REACH/RoHS/UL/SGS/IOS
Model Number:
LE-9516/LH-9516
Document:
Attribute | Value |
---|---|
Viscosity | 200-500 |
Process | APG & Vacuum Casting |
Keywords | electric epoxy resin |
Thermal Decomposition | >320°C |
Adhesion Strength | Strong |
Usage | Electrical insulation |
Component | Type | Amount |
---|---|---|
Epoxy resin | LE-9516 | 100pbw |
Hardener | LH-9516 | 100pbw |
Filler | Silica | 350-400pbw |
Color paste | LC- | 3pbw |
A two component saturated epoxy resin system without premixed filler, liquid at room temperature.
Outdoor high-voltage electrical insulation parts such as: insulators, transformers and other insulation products.
Resin LE-9516 is a modified saturated epoxy resin system. Curing agent LH-9516 is a modified weathering anhydride curing agent.
Resin LE-9516 | Curing Agent LH-9516 | ||||
---|---|---|---|---|---|
Property | Unit | Standard | Property | Unit | Standard |
Appearance | Visual | Transparent-yellow liquid | Appearance | Visual | Transparent-yellow liquid |
Epoxy value | Eq/kg | 4.0-4.5 | Viscosity at 25℃ | mPa.s | 150-400 |
Viscosity at 25℃ | mPa.s | 500-1500 | Density at 25℃ | g/cm3 | 1.17-1.24 |
Density at 25℃ | g/cm3 | 1.16-1.20 | VP | Pa | About 0.5 |
VP at 25℃ | Pa | <0.01 | Flash point | ℃ | About 140 |
Flash point | ℃ | About 135 |
Epoxy resin LE-9516, curing agent LH-9516 and a certain amount of filler can be mixed according to the following curing process after fully mixing under vacuum conditions:
Processing parameters | Automatic Pressure Gelation | Vacuum casting |
---|---|---|
Epoxy Resin/Hardener mixing temperature | 40℃/1-2h | 50-60℃/1-1.5h |
Feeding method | Pressure(0.5-5bar) | Vacuum (casting pot) |
Mold temperature | 130-150℃ | 105℃/4-6h |
Gelation time | 10-50mins | 80℃/4h+100℃/2h+120℃/2h |
Post-curing | 130-140℃×6-10h | 130-140℃×6-10h |
LE-9516:LH-9516=100:100
Temperature | Gel time |
---|---|
at 120℃ | 20-40mins |
at 140℃ | 9-18mins |
at 160℃ | 4-8mins |
Test system: Resin LE-9516 / curing agent LH-9516 / silica flour=100/100/400
Curing conditions: 120°C × 4hours +140°C × 8hours
Note: The following performance data are measured according to the national standard and are for user reference only. The specific application data should be determined according to the actual conditions of the user.
Properties | Typical results | Properties | Typical results |
---|---|---|---|
Tg(DSC) | 60-80℃ | Thermal decomposition temperature | >320℃ |
Tensile strength | 60-80N/mm2 | Water absorption rate (23°C × 10 days) | 0.10-0.20 %by wt. |
Flexural strength | 100-130N/mm2 | Water absorption rate (100°C × 60 minutes) | 0.08-0.15 %by wt. |
Compressive strength | 140-190N/mm2 | Surface resistivity | 1014 Ω |
Impact strength | 8-16kJ/m2 | Volume resistivity | 1015 Ω.cm |
Curing shrinkage | 0.8-1.0% | Dielectric strength | 31 kv/mm |
Flame resistance (4mm) | HB level | Dielectric loss | 0.02 |
Thermal conductivity | 0.8-0.9W/mk |
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