Overview Essential details CAS No.: 1675-54-3 Other Names: epoxy resin potting compound MF: C21H24O4 EINECS No.: 216-823-5 Place of Origin: China Classification: Double Components Adhesives Main Raw ...View More
Messages of visitorLeave a Message
No public comments yet
Clear Liquid Glue Transformer BI Component Curing Epoxy Resin For APG Process